A new domestically developed chip‑scale MEMS active cooling fan is reportedly being tested for advanced Chinese processors. The solution attaches directly to the processor, offering millimeter‑thin profile, near‑zero noise, and ultra‑high thermal conductivity – outperforming traditional internal fans.

MEMS (Micro‑Electro‑Mechanical Systems) technology integrates mechanical structures and electronics on a single chip at millimeter or micron scale. While used today in gyroscopes and microphones, it now enables this breakthrough thermal solution.

Global precedent exists: at CES 2026, Infinix (under Transsion) launched the NOTE 60 series with a 0.1mm piezoelectric MEMS fan operating at 25,000 pulses per second, delivering 10x better cooling than blade fans.

As domestic chips push higher power and performance, traditional cooling falls short. This MEMS‑based active cooling would fill a critical gap in China’s high‑end device ecosystem.

ICgoodFind: Millimeter‑thin, silent MEMS chip fans could solve the thermal bottleneck for next‑gen domestic high‑performance processors.